Showing posts with label SMT Technology,smt nozzle ,SMT parts. Show all posts
Showing posts with label SMT Technology,smt nozzle ,SMT parts. Show all posts

Wednesday, December 13, 2017

The development of SMT Nozzle technology

The development of SMT Nozzle technology

Although the SMT nozzle technology has been developed for many years, has been able to meet the needs of the placement of production, but because of 0201 and 01005 small component applications, nozzle smaller and smaller to bring new challenges to the processing. Now the commonly used nozzle material and processing methods are not impeccable: for example, diamond head nozzle is not a real diamond, but a complex mixture of diamonds and metals, it is too expensive and easy to crack and broken; zirconia nozzle Expensive, but not the metal material hard, and the use of improper easy to break and lobes; PVD coated nozzle in the coating process to withstand a considerable heat, the need for strict cleaning process, especially when the nozzle is a small hole, Improper coating can cause clogging holes; tool steel is not only difficult to process and  expensive.




In fact, the nozzle needs a high wear-resistant part of the nozzle and the nozzle is only the end of the contact, the use of easy processing and low cost of materials, the end of the surface treatment is to solve the nozzle of the important ideas, and application materials and Processing methods and testing methods is the key technology; now use this way the nozzle products have come out.

This nozzle is made of aluminum alloy as the nozzle base, in the end of an electrophoretic ceramic molding technology used for surface treatment and made, as shown in Figure d. Electrophoretic Forming uses ceramic oxidized particles to charge in the electric field to form a higher dense layer. Since this layer is a tightly packed structure, this method can form low-defective ceramics on complex surfaces. Electrophoretic ceramic molding patented technology in a few minutes in the processing of aluminum alloy nozzle tip to produce more than ten microns thick ceramic uniform deposition layer, and good combination with the aluminum alloy.

This kind of aluminum alloy ceramic nozzle through the scanning electron microscopy microstructure inspection and a variety of performance testing, that is a very cost-effective products, in the wear resistance, surface quality, anti-blocking, color and nozzle life are To achieve a satisfactory level, and in the actual test, the simulation completed 3 million times after contact, with the scanning electron microscope to observe the nozzle did not find significant wear and damage; in the middle of the production plant for more than 18 months The test shows excellent performance and no failure occurs.

The following figure is a comparison of several different material nozzle .

Tuesday, December 5, 2017

The development trend of SMT Nozzle

The development trend of SMT Nozzle


With the development of SMT industry,smt parts become minimization, High-density SMT Placement machine as a trend.And the next, SMT placement machine nozzle more sophisticated, the impact on the quality of the placement is also greater in the actual placement process , Due to the nozzle contamination solder, flux or other dirt caused by nozzle clogging, as cause throwing, as early as we stabbed or ultrasonic vibration of the way has been unable to solve the problem.



In this case, the nozzle cleaning machine developed in this situation can be used in a short period of time can not be removed before the dirt on the nozzle to remove the clean and in the cleaning process will not damage the nozzle. As a result of the use of Non-toxic harmless cleaning fluid.


SMT industry development
1. Component miniaturization: the rapid development of the electronics industry makes the components more and more miniaturization, 0402,0201 components more and more common and extensive use, 01005 has also appeared.Is the miniaturization of components is bound to require the corresponding placement machine nozzle To miniaturization, which gives the nozzle to bring the problem of cleaning, if the large nozzle can also be washed through alcohol, fine needle through the hole method had to scrapped.

2. Smaller spacing: Now the electronic equipment requires a smaller size, more powerful, so the circuit board components more and more dense, the distance is getting smaller and smaller, if the past patch slightly flat will not affect so large.

3. Lead-free effect: due to the good activity of lead, if the patch slightly deviated, after reflow soldering can also be corrected, but after lead-free, copper activity greatly weakened, if the patch deviation There is no chance of amendment.

4. In summary, the requirements of the patch accuracy is getting higher and worse, the difference may be absurd. Mounter design accuracy has been quite high, but due to various factors, making its performance Greatly reduced, which is not a clean nozzle is also an important factor.

SMT business requirements
Economic benefits:
1. Reduce the purchase cost of the nozzle
The use of compressed air cleaning machine can fundamentally solve the problem, so that the nozzle recycling. Original nozzle is expensive, mostly in the thousands of people, the use of compressed air cleaning machine can solve the problem, Yuan above, long-term calculation, the economic benefits are considerable.

2. Reduce unnecessary labor
Traditional cleaning methods require a lot of manual processing, the use of compressed air cleaning machine, from one person can complete the work of everyone, and completed even better, more efficient!

3. Reduce the product rate of non-clean suction nozzle is not strong and easy to cause the components of the sliding and throwing phenomenon occurs, resulting in improved product non-performing rate.

4. Improve SMT production efficiency
Proper cleaning allows the nozzle to maintain a new state of work, to avoid the identification of errors, greatly improve production capacity.

SMT nozzle development
Early measures
Alcohol + wind gun
Use a soft cloth stained with alcohol after scrubbing with a wind gun blowing, but this method is not very good to clean the blocked nozzle, and very laborious, nozzle lumen can not be well cleaned, if the alcohol infiltration Reflective layer, causing it to fall off, fade, causing the nozzle to replace the device can not be identified! Although it took a lot of manpower, material, time to clean, but the effect is minimal, and it is easy to destroy the nozzle, it is not desirable.

Function configuration
Use to absorb electronic components, instead of the staff to take the electronic components is it, so that not only can provide work efficiency, the quality of the product is also greatly improved.
feature of product

SMT nozzle, that is, SMT placement machine used to absorb the actual contact with the components of the part of the size of the points, the classification is generally based on the size of its diameter, of course, do not rule out some special-shaped components also have a special nozzle.

Development History
Since the beginning of the 21st century, China's electronic information products manufacturing industry has accelerated the pace of development, each year more than 20% of the speed of rapid growth, a pillar industry of the national economy, the overall size of the world for three consecutive years ranked 2. With China Electronics Industry's rapid development, China's SMT technology and industry are also rapid development, the overall scale also ranks the forefront of the world.

The first stage (1960-1975): miniaturization, hybrid integrated circuit <calculator, quartz watch>
The second stage (1976-1980): reduce the volume, enhance the circuit function <camera, video recorder, digital camera>

The third stage (1980-1995): reduce costs, vigorously develop production equipment, improve product cost <ultra-large scale integrated circuit>

At this stage (1995 - present): micro assembly, high density assembly, three-dimensional assembly

Technology Status: According to foreign data reported that since the 20th century, 90 years, the global use of through-hole assembly technology, electronic products are falling at a rate of ll%, while the use of SMT electronic products are increasing at an 8% rate so far Japan, the United States and other countries have more than 80% of the electronic products using SMT industry.

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