Analysis the whole production of process smt splice tape
Silk screen (or dispensing) ----- mount (curing) ---- Reflow ---- cleaning ---- testing ----- rework
Silk screen: its role is to paste or paste plastic Leakage printed on the pad to the circuit board, in order toprepare the welding components. The equipment used for the screen printing machine
(screen printing machine), smt in the belt with the forefront of the production line. In this case,
smt splice tape.
Dispensing: It is the glue drops to a fixed position on the circuit board, its main role is to be
fixed to the circuit board components. The equipment used for the dispenser, smt is located in the
forefront of the production line or testing equipment behind.

In this case,Placement: The role of surface mount components is accurately installed to the circuit board fixed position. The equipment used for the placement machine, smt with the production line in the back of the screen printing machine.
Curing: its role is to melt patch glue, so that the surface assembly components and circuit boards firmly bonded together.
The equipment used for the curing furnace, smt is located in the production line with the placement
machine in the back.

Reflow soldering: its role is to solder paste to melt, so that the surface assembly components and
circuit boards firmly bonded together.

The equipment used for the reflow furnace, smt is located in the production line with the placement
machine behind.

Cleaning: The role of the circuit board assembly is harmful to the human body above the welding
residues such as flux removed.

The equipment used for the cleaning machine, the location can not be fixed, can be online, or not online.
Detection: The role of the assembled circuit board for welding quality and assembly quality testing.
The equipment used is a magnifying glass, microscope, on-line tester (ICT), flying probe tester, automatic

 optical detection (AOI), X-RAY detection system, functional tester. Location according to the detection
needs, can be configured in the production line where appropriate. Rework: Its role is
to detect the failure of the circuit board rework. The tools used for the iron, rework stations.
Configured anywhere in the production line.

What is the reason for the unqualified of SMT chip processing?

SMT process frequently quality problems are missing pieces, side pieces, flip pieces, offset, loss pieces, etc.,

Now learn much more about the quality of SMT chip process problems as follows.

First, the main factors leading to patch leakage:

1. the components for the feeder frame feeding is not in place;

2. the nozzle of the gas nozzle block, nozzle damage, nozzle height is not correct;

3. the equipment of the vacuum air circuit failure, blocking;

4. bad circuit board purchase, resulting in deformation;

5. there is no solder paste on the circuit board solder paste or solder paste too little;

6. component quality problems, the same variety of thickness inconsistency;

7. patch processing used in the placement machine call procedures are missing, or programming parameters of the thickness of the components of the wrong choice;

8. human factors accidentally knocked out.

Second, leading to SMC resistor patch when the flip, 

the main factors:

1. the feeder feeder (feeder) feeding abnormal;

2. the tip of the nozzle is not right;

3. the height of the head of the loading head is not right;

4. the size of the material packing hole is too large, the components due to vibration flip;

5. bulk material into the tape when the direction of anti.

Third, the components lead to chip components of the main factors:

1. the placement machine programming, the components of the X-Y axis coordinates are not correct;

Joy Technology Co., Limited was established in 2012,Adhering to the business philosophy Of "Only For Better", 
we seek to achieve win-win results for our customers, employees andeveryone in the community where we 
operate our business.

Joy technology Co., Limited is recognized for the expertise in service of Surface Mount Technology area and
offer most major brands of electronic assembly equipmentswith a large selections of compatible SMT automotive 
spare parts, such as Juki, Sony, Sumsung, Fuji, Hitachi , Panasonic, Phillips, Sanyo, SIEMENS, Universal and Yamaha,
and also as well as new/used SMT machine trading, provide repair SMT key parts service, provide SMT consumables 
and Peripherals equipment, ESD products.

We always adhere to honesty, high-quality products and good price to impress clients, not the pursuit of short-term interests, stick to the path of sustainable development

Our main service range include:
1. Provide SMT spare parts 
We have good sourcing and large in-stock SMT Spare parts available for major brand SMT automotive spare parts. Such as, nozzle , nozzle holder,nzzle shaft, feeder/feeder parts, , servo motor, driver, controller board, , laser sensor ,solenoid valve, ball screw, belt, signal cable.

2. Sell and buy new/used SMT Machine 
we also sell and buy new/used SMT Machine, with our experienced professional engineer team, we can check how well percent of your SMT machine and how much it will be worth, we guarantee we will use the best channel to sell or buy your SMT machine and make long-term business relationship with each other. So, pls don’t hesitate to contact with us if you have any new or used SMT machine.

3. Sell SMT consumables 
We also sell SMT consumables ,including: clean paper, then tape, anti-static, thermocouples, pcb universal thimble, smt lubricants, cotton filters.

4. Sell SMT Peripherals equipment
Sell wave soldering and reflow soldering Peripherals equipment, solder paste printer etc

5. Repair service for key parts 
We have advanced technology and good experienced professional engineer to provide repair service for key parts, like laser sensor, servo motor, driver, controller board etc. Quality guaranteed period is offered after repair service. Pls don’t hesitate to send us the faulty key parts for repair if you have. We will repair it and send back to you with warranty

Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. It can also be applied by a jet-printing mechanism, similar to an inkjet printer. After pasting, the boards then proceed to the pick-and-place machines, where they are placed on a conveyor belt. The components to be placed on the boards are usually delivered to the production line in either paper/plastic tapes wound on reels or plastic tubes. Some large integrated circuits are delivered in static-free trays. Numerical control pick-and-place machines remove the parts from the tapes, tubes or trays and place them on the PCB.

The boards are then conveyed into the reflow soldering oven. They first enter a pre-heat zone, where the temperature of the board and all the components is gradually, uniformly raised. The boards then enter a zone where the temperature is high enough to melt the solder particles in the solder paste, bonding the component leads to the pads on the circuit board. The surface tension of the molten solder helps keep the components in place, and if the solder pad geometries are correctly designed, surface tension automatically aligns the components on their pads.

There are a number of techniques for reflowing solder. One is to use infrared lamps; this is called infrared reflow. Another is to use a hot gas convection. Another technology which is becoming popular again is special fluorocarbon liquids with high boiling points which use a method called vapor phase reflow. Due to environmental concerns, this method was falling out of favor until lead-free legislation was introduced which requires tighter controls on soldering. Currently, at the end of 2008, convection soldering is the most popular reflow technology using either standard air or nitrogen gas. Each method has its advantages and disadvantages. With infrared reflow, the board designer must lay the board out so that short components don't fall into the shadows of tall components. Component location is less restricted if the designer knows that vapor phase reflow or convection soldering will be used in production. Following reflow soldering, certain irregular or heat-sensitive components may be installed and soldered by hand, or in large-scale automation, by focused infrared beam (FIB) or localized convection equipment.

If the circuit board is double-sided then this printing, placement, reflow process may be repeated using either solder paste or glue to hold the components in place. If a wave soldering process is used, then the parts must be glued to the board prior to processing to prevent them from floating off when the solder paste holding them in place is melted.

After soldering, the boards may be washed to remove flux residues and any stray solder balls that could short out closely spaced component leads. Rosin flux is removed with fluorocarbon solvents, high flash point hydrocarbon solvents, or low flash solvents e.g. limonene (derived from orange peels) which require extra rinsing or drying cycles. Water-soluble fluxes are removed with deionized water and detergent, followed by an air blast to quickly remove residual water. However, most electronic assemblies are made using a "No-Clean" process where the flux residues are designed to be left on the circuit board [benign]. This saves the cost of cleaning, speeds up the manufacturing process, and reduces waste.

Certain manufacturing standards, such as those written by the IPC - Association Connecting Electronics Industries require cleaning regardless of the solder flux type used to ensure a thoroughly clean board. Even no-clean flux leaves a residue which, under IPC standards, must be removed.[citation needed] Proper cleaning removes all traces of solder flux, as well as dirt and other contaminants that may be invisible to the naked eye. However, while shops conforming to IPC standard are expected to adhere to the Association's rules on board condition, not all manufacturing facilities apply IPC standard, nor are they required to do so. Additionally, in some applications, such as low-end electronics, such stringent manufacturing methods are excessive both in expense and time required.

Finally, the boards are visually inspected for missing or misaligned components and solder bridging. If needed, they are sent to a rework station where a human operator repairs any errors. They are then usually sent to the testing stations (in-circuit testing and/or functional testing) to verify that they operate correctly. Automated Optical Inspection (AOI) systems are commonly used in PCB manufacturing. This technology has proven highly efficient for process improvements and quality achievements.

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

By employing SMT, the production process speeds up, but the risk of defects also increase due to the components miniaturization and denser packing of boards. In those conditions, the failures detection have become critical for any SMT manufacturing process.

An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short ponins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminatis on the body of the component.
Much more technical materials refer to website: Joy Technology Co.,Limited