What is the reason for the unqualified of SMT chip processing?

SMT process frequently quality problems are missing pieces, side pieces, flip pieces, offset, loss pieces, etc.,

Now learn much more about the quality of SMT chip process problems as follows.

First, the main factors leading to patch leakage:

1. the components for the feeder frame feeding is not in place;

2. the nozzle of the gas nozzle block, nozzle damage, nozzle height is not correct;

3. the equipment of the vacuum air circuit failure, blocking;

4. bad circuit board purchase, resulting in deformation;

5. there is no solder paste on the circuit board solder paste or solder paste too little;

6. component quality problems, the same variety of thickness inconsistency;

7. patch processing used in the placement machine call procedures are missing, or programming parameters of the thickness of the components of the wrong choice;

8. human factors accidentally knocked out.

Second, leading to SMC resistor patch when the flip, 

the main factors:

1. the feeder feeder (feeder) feeding abnormal;

2. the tip of the nozzle is not right;

3. the height of the head of the loading head is not right;

4. the size of the material packing hole is too large, the components due to vibration flip;

5. bulk material into the tape when the direction of anti.

Third, the components lead to chip components of the main factors:

1. the placement machine programming, the components of the X-Y axis coordinates are not correct;