Optimization case of abreast smt nozzle style placement machine

Optimization case of abreast smt nozzle style placement machine 

1.SMT Feeder position considerations: For abreast nozzle of placement machine feeder position is slightly different from the turret style,

The arrangement principle is as follows:

(1) The classification is based on components, the same type of components is arranged together, as far as possible to achieve simultaneous sampling. Side-by-side nozzle, between the two nozzles have a fixed distance (such as GSM is 20mm width), this distance is just with the station 8 mm feeder is equal, in order to save the picking time, the best way is to patch the first nozzle at the same time to absorb the components, such as less than 12 mm components are arranged together, 16 mm components are arranged together, greater than 20mm Of the components are arranged together.

(2) The same type of components placed in the order on the feeder, should first place the most components of the number of components, followed by the placement of a relatively large number of components, and finally placed fewer components components. Components placed as much as possible to patch position The placement of the material and the placement of the total travel the shortest principle, such as the placement of the location of the central part of the board, the feeder position is preferentially installed in the middle of the printed circuit board near the middle of the station, you can save the head back and forth moving time. In addition, for the board to install a larger number of components, in order to save time to pick up a feeder can be changed to a number of feeder, while picking, while the same time, Extend the refueling time, save machine downtime.

(3) it will be placed in the placement of the components are not far apart, the placement of the patch to reduce the moving distance.

2. Programming considerations.
(1) Minimize the number of nozzle replacements. The components are arranged in the same type, and the nozzle can draw such components at the same time. When the type of suction nozzle is completed, replace the next nozzle type and avoid frequent replacement of the nozzle. When more than one make-up placement programming, you can make the puzzle expansion as a whole board placement, reduce the number of nozzle replacement.

(2) To reduce the loading and unloading head before and after the material to move back and forth distance in the element reclaiming material, as far as possible in the machine for a feeding platform for material, such as only in the back of the material station to take, to avoid before and after the material caused by the increase in moving time .

(3) To Consider the ccd camera ,and the general placement machine has two sets of cameras, the first group installed in the patch head, the components picked up, the patch head in the process of moving to complete the flight identification to the middle of time, The camera is usually handled with components smaller than a certain size, for example, less than 20mm. The second group is mounted on a part of the machine and the suction nozzle picks up the components and needs to be identified on the camera. This will take part of the movement time , Usually this type of camera to identify the larger high-precision components, such as more than 20mm components. In programming, try to make multiple nozzles to pick up, identify and mount at the same time as far as possible not to absorb the need for two kinds of camera identification components , To spend more time to identify the entire placement of the head to wait for all the nozzle to complete, to absorb the next set of components.

(4) Tray discs to consider. General multi-function machines, all with a number of waffle Tray disk. Mounter is usually a Tray disk to move to the patch picking position, after drawing components, and then replace another Tray disk , Because Tray mobile replacement speed is slower than the placement speed, multi-nozzle side by side patch, if the adsorption components did not reach all, need to wait for the arrival of the next Tray disk components, so a waste of time. Programming should be considered, in the replacement Tray Disk time, patch head do not have to wait, to install other components, and then go to absorb  ic tray components.

Solution for Panasonic CM602 nozzle to identify the wrong

Solution for Panasonic CM602 nozzle to identify the wrong 

During the use of Panasonic CM602 nozzle operation, there is often encountered in the smt nozzle

to identify the wrong mouth,

The reason is the reflective plate spent, how to solve the case without changing it?

There are two reasons for this problem.
1. The camera lights a little bright, serious words is not enough, you must replace the nozzle.

2. The size of the alarm may be caused by the following reasons:
(1) There is a foreign body at the tip of the nozzle
(2) SHAFT Bend or HOLDER exception

Frequently asked questions for Placement Machine

Frequently asked questions for Placement Machine


We've been using contractors for circuit board prototyping and assembly. What makes you so sure we can do these tasks in-house with no previous experience?

Many companies have seen a major decrease in PCB production expenses by bringing their circuit board prototyping and assembly in-house. Quicker turn-around, better quality control and faster test and implementation of engineering changes are added advantages.

Can anticipated savings from building boards in-house be realistically calculated? If so, how?

If you are presently outsourcing PCB assembly, your invoices should reveal cost-per-board assembly. In-house production costs can be estimated by totaling costs of materials (raw boards), components and labor. For a truer perspective, utilities and two-year equipment amortization should also be factored in.

Where can we get a quick education on circuit board assembly?

The basic technology is not all that complicated. Access this link for a 5-minute presentation on the basics of circuit board assembly. You'll easily grasp the role of each machine in the assembly process.

How much dedicated floor space is required for a pick and place machine?
The dimensions of each machine are usually found in manufacturers' specifications. 

Just total the combined square footage of all machines, plus figure at least an additional 3 sq. ft. width around the entire perimeter of your assembly line to allow for feeders and operator access. If future equipment purchases are contemplated, it would be wise to also allocate this space at startup.

What do you figure our upfront costs—including equipment—will be?

Our Buyers Guide will be of major help in determining costs of pick and place machine. For stencil printer and reflow oven estimates, we recommend accessing websites of reliable equipment providers, such as www.joysmt.com.

Will this move increase our manufacturing payroll?

Possibly not, since an existing non-experienced employee or two can be trained to program and operate PCB production equipment. Your equipment vendor should provide onsite training and stay until your people are at ease with his machines.

How long will it take us to be up and running?

Once the equipment is installed and operators trained, it should take no more than two or three weeks to be in production. You will need this additional time to acquire bare boards, stencil(s) and component inventory.

Other than price, what criteria should be used for selecting an equipment supplier?
First, ask for and do contact a few of the prospective vendor's customers. Find out their experience with the machine(s) and if the location is convenient to you, arrange a visit so you can see the equipment in operation. Above all, be certain the machines you are considering will build your product effectively. Allow room for growth to protect your product investment. This is especially important if your product and component mix will change or production targets expand.

Analysis of smt nozzle Material

Analysis of smt nozzle Material

Smt nozzle have many various kinds of material, quality and feature is difference, and with advantages & defects, 

For this sutiation,Joysmt do a simple comparison, only providing a reference.

1.The feature of  Wolfram stee smt nozzle : 

it have the advantages  of cheap & toughness ,but a defect that tends to whiten 

2.Smt ceramic nozzle: The advantages never whiten, the price is not expensive, the disadvantage is easy to

 fragmentation.

3. Diamond steel nozzle: The advantages never whiten, and it is difficult to break off, The disadvantage is 

expensive.

The PCB Used In Marine Industry Paving Way For Innovations

The PCB Used In Marine Industry Paving Way For Innovations

As the technology has become a universal key to major developments, the marine and boat industry has shown elevated growth in recent time. The marine market circumscribes on the electronic and design solutions for every single innovation. All the developments in Marine sector has and are heading towards a notion of modernization and among these, printed circuit board is grounding the research and developments. How to increase the efficiency of the device? How to gain optimum fuel efficiency? Does the dual fuel concept become a buzz word for major innovations? These are the basic questions which are considered to bring new novelties in the market. This article is a detailed conspectus of marine and boat industry and the role of printed circuit boards in manufacturing modified marine electronic instrumentation. This will also drive you to the spotlights into the use of PCB prototypes, PCB assembly and PCB Design in Maritime industry, the commendable marine innovations/ New concepts and the prime factors affecting the modernization in the marine industry.

Awash with modernization, the marine market shows innovations in safety devices, telematics, equipments with resistance to vibration, underwater marine machinery and many more. The marine and boating industry shows a major concern for the protection of electrical resources from destruction due to climatic reactions and global warming. With this, the Submarines, weather sensors, marine gauges, underwater equipment, crane, flood detector, galvanic Isolator, fuel efficient motors and other tough marine applications need proven design to engineer the marine vessel manufacturing.

The electric connectivity and mechanical support provided by marine PCB’s is at the base to create an all to gather efficient Marine machinery and aquatic vessel. From manufacturing ship, yachts, craft and other aquatic vessels depend on printed circuit boards to control the marine mechanism with electronic process. Among all, Rigid/Flex PCB is majorly used in providing electronic solutions that have an efficient RF Module. The maritime electronic PCB are of many types depending upon the purpose of use. The double layered and multi layered PCB is used for complex compositions of marine vessels. Also high grade PCB material is used in the circuit board that well suits the climatic reactions in the sea. The PCB is at the base of every single marine innovation happening across the globe. To explore more insights into the PCB used in the Marine industry, it is equally important to know about the current Maritime industry.

Initially the marine market marked stagnation before few decades. Gradually, with a drift in technology, the boat and marine industry has picked up a pace with new developments. This can be marked in marine civil construction and engineering, underwater ad diving technology, marine equipment, marine electronics, renewable energy and marine security. The research for developments in maritime sector has added crowns in the small devices and large equipment as well. Few developments seen in small marine devices are outlined as under:


Marine load testing is an electronic portable equipment with strong hydraulic cylinder and customized ropes to create more than 120 tonnes of pull underwater. The underwater Impact torque device is a marine electronic tool to strongly tighten the screw and nuts to perfect torque. The saltwater pressure washer that works with the help of Diesel and is extensively used for maintenance and cleaning of wind farms. The design and structure of the machine is such that has resistance to the marine conditions and can efficiently wash the offshore wind farm. The radio combiner and other marine telecommunication devices have an ergonomic design for compact high speed craft.

Apart from these, boat/ship dashboards, exit lights, marine spotlights, navigation system, electronic counter measurement device, engine management, radar system, beacon and strobe system have markedbreakthrough modifications to make it a fuel efficient and time savvy marine operations.

Recent Concepts:
0The Advance Outfitting is the time and cost saver technique to manufacture the ship and heavy marine machineries. In this method, the ship building process involves assembling the marine outfits like seating, piping, machinery in a small unit which is fixed at its actual position afterwards in the hull block. This saves much time and cost as before the ship building process the hull is fabricated first and after launching the hull from the berth, the outfitting process starts that proves to be tedious and time consuming.

The Green Ship Technology to reduce the carbon is a step ahead to environmental protection. It has a solar cell integration with effective anti ballast system. For making marine operations greener, many other marine electronic devices are launched in the market that includes the optimized cooling system, engines to bring down the level of nitrogen oxide level, exhaust scrubber, solar cell hybrid system, dual fuel motors and many more.

Be it a new or an old concept driving the marine operations, few factors affect the modernization in Marine innovations. Among which the Environment is a top most factor of prime consideration. Another aspect that brings a Dinger in the maritime industry is making a move towards Digitalization of all the marine operations. At the end, researchers are now striving to trigger the innovations in electronic instruments and control system that has high applicability in the Marine industry. Among which the different types of PCB prototypes and PCB assembly services are grounding the studies to come up with better and better solutions for marine machine manufacturing.

More details of SMT Technology,pls refer to : Joy Technology Co., Limited

2.5D and 3D Semiconductor ---SMT Technology

The electronics industry is experiencing a renaissance in semiconductor package technology. SMT technology is very important，a growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. Multiple die packaging commonly utilizes some form of substrate interposer as a base. Assembly of semiconductor die onto a substrate is essentially the same as those used for standard I/C packaging in lead frames; however, substrate based IC packaging for 3D applications can adopt a wider range of materials and there are several alternative processes that may be used in their assembly. Companies that have already implemented some form of 3D package technology have found success in both stacked die and stacked package technology but these package methodologies cannot always meet the complexities of the newer generation of large-scale multiple function processors.

A number of new semiconductor families are emerging that demand greater interconnect densities than possible with traditional organic substrate fabrication technology. Two alternative base materials have already evolved as more suitable for both current and future, very high-density package interposer applications; silicon and glass. Both materials, however, require adopting unique via formation and metallization methodologies. While the infrastructure for supplying the glass-based interposer is currently in development by a number of organizations, the silicon-based interposer supply infrastructure is already well established.

This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts.

Key words: 2.5D, 3D Semiconductor Package Technology, Through Silicon Via, TSV, Through Glass Via, TGV

Introduction
A majority of the semiconductor die elements continue to be designed with bond sites at the perimeter edge. For a wide range of applications, both single and multiple die-stack package assembly processes will likely continue to employ conventional face-up die attach and wire-bond methodology. The use of wire-bond interconnect as the exclusive means of termination, however, is somewhat restrictive because it requires significant surface area to accommodate the die-to-interposer wire-bond process. In regard to die-stack package assembly, managing the layout of several hundred interconnects and their wire-loop profile restrictions will entail a great deal of planning.

Even though a great deal of progress has been made in process refinement and system development, methodologies will vary a great deal. To ensure a strong infrastructure for 2.5D and 3D applications the industry will need a degree of harmonization and standardization. There are a number of multiple die package issues that will need to be resolved, including;

Selection of suitable component functions for multiple die packaging

Establish a reliable source for semiconductor elements

Specify physical and environmental operating conditions

Define package design constraints and understand process protocols

Stipulate electrical test method and post assembly inspection criteria

3D Semiconductor Package Innovations

Within the current decade the industry has developed an impressive family of multiple die solutions. A majority of the innovations utilized the existing package manufacturing infrastructure while others require the development of specialized materials and process systems. The organic interposer base will likely remain popular for a significant number of multiple die applications. To enable more efficient processing of multiple die sets, the substrates are furnished in a panel or strip format. In regard to assembly, when stacking two or more semiconductors onto a single interposer substrate for wire-bond assembly, the die elements will ideally have a progressively smaller outline. This tiered or pyramid die format has been very successful, generally furnishing the lowest overall multiple die package profile.

In this configuration, each die element is sequentially attached on top of one another. The progressively smaller die outline leaves the edge of all die elements accessible for wire-bond processing in a single operation.



Following molding operations, alloy ball contacts are commonly applied in the now familiar array format on the opposite surface of the interposer to accommodate electrical test and the eventual mounting of the finished package on the next level assembly. Because these heterogeneous die elements are mounted onto a single high-density interposer structure, the primary signal paths can be very short, contributing to increasing operating speed and power reduction. Although multiple die package technology has reached a level of maturity, package assembly yield may be adversely impacted when one or more die in the stack do not perform to their expected level or fail altogether.

When die elements have the same outline or nearly the same outline, thin silicon spacers are added between die elements to accommodate wire-bond loop heights. The example furnished in Figure 2 represents a stacked die assembly using a number of semiconductor die elements having the same outlines.


Excessive overall package height can be a critical roadblock for a number of personal hand-held product applications. For example, same size die elements generally represent memory functions. Unlike the tiered die assembly noted above, the memory die-stack process is less efficient. Although all memory die elements are assembled onto a common interposer base, die-attach and wire-bond operations for each die element must be completed before progressing to the next level. Even though the die elements can be made very thin, the accumulated stack-up height generated by the added spacer and wire-bond loop profile may not meet all package profile requirements.

3D Package-on-Package Solutions for Heterogeneous Applications

Combining the memory and logic functions in a single package outline has often compromised both test efficiency and overall package assembly yield. Vertically mounting one or more pre-packaged die elements (package-on-package) has evolved as a preferred alternative to die stacking, especially for applications requiring multiple heterogeneous semiconductor elements and, separating dissimilar logic and memory functions has proved to be very efficient. The logic die element often have a significantly larger outline and a greater number of I/O than the memory elements. For this reason, the base or lower package section will typically accommodate the logic while the memory functions associated with the logic die will be

deployed to the upper section of the package. Additionally, the package sections may utilize both wire-bond and flip-chip assembly methodologies. The flip-chip assembly will enable significant in-package interconnect capability and provide a very low package profile for the bottom section. This design illustrated in Figure 3 allows the mold material to extend out to the edge of the interposer on the lower section to minimize package warp and utilizes a through-mold-via (TMV) enabling smaller and closer pitch contact features between the upper and lower section.

Even though two substrate interposers are required for the PoP application, the joining of individually tested package sections have proved more economical.

Many of the more advanced 3D package solutions involved a great deal of engineering resources before they were made available for volume manufacturing and, although widely available, some variations will require licensing agreements with the developer before use.

Bond Via Array PoP

To overcome the limiting aspects of the more traditional PoP assembly method shown above, an alternative high-density substrate interconnect solution has evolved. The bond via array process enables a substantial reduction in interface contact pitch between the lower and upper package sections. The main feature of the bond via array concept is the use of commercially available organic based substrate materials and conventional wire-bond systems to furnish the closely spaced narrow copper-post contacts that provide electrical interface between upper and lower package sections. The detail shown in Figure 4 illustrates the upper and lower sections of the bond via array package.

Evolving 2.5D Interposer Technology

New semiconductor families are emerging that demand greater interconnect densities than possible with today’s organic substrate fabrication technology. Two alternative base materials have already proved to be more suitable for the both current and future very high-density package applications. The two base materials with the physical attributes considered most capable for the very high-density interposers are silicon and glass. Both materials, however, require adopting unique via formation and metallization methodologies to enable the interface between one side of the interposer to the other. The term

through-silicon-via (TSV) is applied to miniature ablated and plated via features in the silicon-based interposer. Likewise, furnishing similar features on the glass-based interposer is referred to as Though-Glass-Via (TGV). While the infrastructure for supplying the glass-based interposer is progressing, the silicon-based interposer supply infrastructure is already well established.

Silicon Interposer Fabrication
A great deal of resources have already been invested to bring TSV into a viable interconnect solution for both 2.5D interposers and 3D stacked-die assembly. In preparation for TSV, small diameter holes are first formed on one side of the silicon wafer. The most common process for this operation uses a deep reactive-ion etching (DRIE) process The via ablation process is also known as ‘pulsed’ or ‘time-multiplexed’ etching, a process that alternates repeatedly between two modes to achieve nearly vertical hole structures. During the pulsed etching process a passivation layer is naturally formed onto the vias sidewall to block further chemical attack and to prevent additional etching within the via sidewall. These etch/deposit steps are repeated until the ablation reaches the desired depth 

Although it is possible to etch via holes all the way through the silicon base, it is common practice to stop the etching process at a predetermined depth that will better promote via filling during the metalization process.

In preparation for via filling a seed layer of copper or tungsten is first applied to enable electroplating the additional copper required to complete the via fill operation. Electroplating is commonly employed for via sizes that range between 5μm and 20μm. To finally access the metallized Cu filled vias on the opposite surface of the wafer, a combination of grinding and/or plasma etching processes are utilized. Further pattern plating processes are finally employed to provide surface interconnect features as illustrated 

Because of its low resistivity and conductive characteristics, copper (Cu) has become the favored alloy for interposer via and circuit plating. In preparation for forming the Cu component termination sites (land patterns) and conductors on the silicon wafer surface, the fabricator will first sputter a metal alloy adhesion layer on the wafers surface. Adhesion-promoting metals include: nickel (Ni), molybdenum (Mo), chromium (Cr), tungsten (W), and titanium (Ti). These base materials are then over-plated with a more conductive metal such copper, gold, tin and palladium. Following the pattern plating the remaining thin adhesion layer is chemically etched from the silicon wafer surface followed by the application of a photo-imaged passivation 60μm

contact features located on the individual die elements may have a pitch as small as 30μm to 50μm, while the contacts on the bottom surface of the Si interposer are ‘fanned out’ to a wider 150μm to 200μm pitch. The illustration shown in Figure 9 is typical of silicon or glass interposer enabled 3D system level product with related but heterogeneous semiconductor die elements.




The wider pitch contact pattern on the bottom surface of the Si-based interposer will better accommodate solder ball or solder bump contacts for reflow solder attachment to the top surface of the organic based package substrate.

Three accepted methodologies for joining high-density semiconductors to the silicon-based interposer include 1) solder reflow processing, 2) thermo-compression bonding and 3) annealed copper bond interconnect 

Reflow soldering- The contact furnished for the very fine-pitch die-to-interpose attachment process is a ‘solder capped’ copper post or micro-bump contact. Key solder process issues include optimizing reflow temperature profiles, flux activation and time above liquidus (TAL). Because the standoff dimension between die and interposer surface can be 50 microns or more, underfill is commonly specified to reinforce the site. Flux selection can also be a factor. Any remaining flux residue that accumulates on the interposer surface during the solder process can promote excessive voids in the underfill.

Thermo-Compression Bond (Cu/Sn/Cu Fusion)- A two-stage procedure that begins with the initial precise alignment and room temperature pre-bonding of the die element to the interposer wafer. Following pre-bond, the interposer is exposed to an annealing process that includes high temperature and pressure. This joining process is significantly enhanced with the deposition of a thin layer of tin-alloy onto the exposed copper contact features. When the wafer interposer is heated to approximately 400oC, the tin alloy layer completely diffuses into the apposing copper contact features to form a stable Cu-Sn- Cu (Cu3Sn) intermetallic.

Low Temperature Hybrid Bond Technology- A heterogeneous or hybrid joining process furnishing an In-Situ electrical interface with patterned metal alloy contact surfaces and silicon oxide dielectric (e.g., Cu/SiO-Cu/SiO, Cu/SiN-Cu/SiN). This is a simple Cu-Cu bond that is scalable to a much finer contact pitch (< 30μm). Furthermore, when the die element is bonded

to the silicon interposer there is no remaining air gap so application of underfill between surfaces is not required. The direct bond interconnect process is also being utilized for thin wafer-to-wafer joining as well as joining singulated die prepared with aligned TSV contact features. The actual Cu-Cu annealing process for this requires a relatively short exposure time at a moderate 200 oC temperature.

Summary and Conclusions

While developers continue to explore alternative semiconductor package assembly methods to further improve yield, significant challenges remain for the newer generations of high-density and high I/O semiconductors. Although high volume consumer electronics will continue to drive similar forms of 3D package technology, high-end Telecom markets will rely on more sophisticated solutions. New generations of memory products have emerged with 30 micron pitch and two-thousand I/O and processors are entering the market that have forty-thousand I/O. To meet the requirement for interconnecting these very large, high I/O die elements, analysts and industry roadmaps predict that companies will continue to migrate toward silicon-based or glass-based interposer technology. Although many process issues have been resolved, there are a significant number of technical issues that influence this segment of the industry. The handling and transport of the large and very thin wafers, solutions for aligning and joining very high I/O die elements, and, when the system level package is incorporated into the end product, methodologies for managing thermal dissipation.

The decision on which interposer base material is selected will be dependent on process maturity, supplier capability and cost. In order to expedite product development many are partnering with suppliers at both the frontend and backend of the semiconductor supply chain. They realize that in order to bring 2.5D and 3D package technology into the forefront they will need to develop viable and robust, high yield wafer level interposer processes.

Panasonic CM202 CM402 CM602 NPM Nozzle 110 115 KXFX0383A00
​

  
KXFX0383A00 Nozzle 110
KXFX037NA00 Nozzle 115A
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N610040853AA Nozzle 240CSPanasonic MMC SMT Nozzle X01B40035
PANASONIC MMC  0201
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